TRI launches new 3D AXI platform
Test Research, Inc. has introduced its latest high-throughput X-ray inspection system, targeting electronics manufacturing and advanced packaging applications.
Test Research, Inc. (TRI) has launched the TR7600 SV Series, a new line scan 3D automated X-ray inspection (AXI) platform designed to improve inspection throughput and defect detection in electronics manufacturing environments.
According to the company, the new system delivers up to 20% higher performance than its predecessor and supports inspection of BGAs, through-hole technology (THT) components and System-in-Package (SiP) devices.
The platform offers multi-resolution imaging from 7 to 25 µm and accommodates PCB sizes of up to 1000 x 660 mm.
The TR7600 SV Series incorporates AI-powered defect detection and image processing capabilities, including AI image denoising, automated verification and programming optimisation tools designed to reduce setup times and improve inspection accuracy.
TRI said the system also supports Industry 4.0 manufacturing environments through compliance with standards including IPC-CFX, SECS/GEM, SMEMA and IPC-HERMES-9852.
The new platform is aimed at manufacturers seeking higher inspection throughput and improved quality control across increasingly complex electronic assemblies and advanced packaging designs.
