Asahi Kasei PSPI film for packaging
Asahi Kasei has developed a new photosensitive polyimide film aimed at improving yield and productivity in panel-level semiconductor packaging, with customer evaluation already underway.
Asahi Kasei has developed a new photosensitive polyimide (PSPI) film designed to support next-generation panel-level semiconductor packaging, as the industry shifts toward larger-format substrates and higher-density integration for AI-driven applications.
The material combines the company’s PIMEL liquid PSPI, used for buffer coatings and passivation layers, with SUNFORT dry film photoresist technology, enabling a hybrid approach that supports both insulating layers and fine circuit patterning through a lamination process.
According to the company, the PSPI film is designed to improve manufacturing productivity by enabling uniform application across large square panels, while also supporting an increased number of insulating layers required in advanced packaging architectures.
The material is intended for use in redistribution layers and package substrates, with additional development underway to integrate it with SUNFORT CX series resists for forming high-aspect-ratio copper pillars used in 3D packaging structures.
Asahi Kasei said the technology aligns with growing demand for higher-density semiconductor packaging for AI data centres, where panel-level approaches are increasingly viewed as a route to improving throughput and reducing cost compared with wafer-level processes.
The PSPI film is currently under customer evaluation, with commercial availability expected in the near future.
