TSMC and Amkor expand U.S. packaging
A new 10-year agreement will expand advanced packaging and test capacity in Arizona, supporting growing AI and HPC demand.
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have announced a 10-year partnership aimed at expanding advanced semiconductor packaging and test capabilities in Arizona.
Under the agreement, TSMC will procure advanced packaging and testing services from Amkor as the two companies work together to strengthen semiconductor manufacturing capacity in the United States.
The collaboration is designed to support growing demand for high-performance computing, artificial intelligence, and advanced electronics applications.
The companies said the partnership will help create a more integrated domestic semiconductor supply chain, enabling faster time-to-market for customers while enhancing supply chain resilience.
"We have a long history of working with Amkor globally in advanced packaging," said Kevin Zhang, senior vice president and deputy co-COO of TSMC. "We are confident that our collaboration in the United States will be successful as we look to enhance our capabilities to jointly serve our customers."
Amkor CEO Kevin Engel said the agreement represents an important step toward establishing a complete U.S.-based semiconductor manufacturing flow, from wafer fabrication to advanced packaging and test.
The announcement aligns with ongoing investments by both companies in Arizona, where TSMC is developing advanced semiconductor fabrication facilities and Amkor is building an advanced packaging and test campus.
As AI and HPC systems increasingly depend on advanced packaging technologies to improve performance, power efficiency, and integration density, collaborations between foundries and OSAT providers are becoming a critical component of semiconductor supply chain strategy.
