Glass core substrates gain traction
A new SEMI report projects rapid long-term expansion for glass core substrates, positioning the technology as a potential next-generation solution for AI and high-performance computing packaging.
SEMI, in collaboration with Global Net Corp., has released a new report highlighting the emerging role of glass core substrates in advanced semiconductor packaging, forecasting strong growth driven by AI and high-performance computing (HPC) applications.
The report, Glass Core Substrate Market and Development Trends, outlines how glass-based substrates are being evaluated as a potential successor to conventional organic materials in high-end packages.
Key advantages include improved dimensional stability, support for finer interconnect pitch, and suitability for increasingly large and complex chiplet-based architectures.
According to the report’s scenario analysis, the glass core substrate market could see a compound annual growth rate (CAGR) of 67.2% between 2028 and 2040, with initial production expected to begin around 2028 in select high-performance applications.
SEMI notes that advanced packaging has become central to semiconductor innovation as traditional device scaling slows, with glass substrates emerging as one of several candidate technologies being explored to meet AI-driven performance demands.
The report also highlights potential applications across AI accelerators, HPC systems, advanced processors, co-packaged optics, and image sensors, alongside growing global activity in materials development, equipment, and supply-chain ecosystems.
While commercialization challenges remain, the study positions glass core substrates as a key area of interest in the next phase of advanced packaging evolution.
