Applied Materials and Broadcom partner on AI packaging
Companies to collaborate on next-generation advanced packaging technologies for AI systems through Applied Materials’ EPIC platform.
Applied Materials and Broadcom have announced a partnership focused on accelerating the development of advanced chip packaging technologies for next-generation AI systems.
Under the collaboration, Broadcom will join Applied Materials’ EPIC platform, enabling joint research and development across packaging technologies, materials, and process equipment.
The companies will also leverage Applied Materials’ global network of innovation centers to support co-innovation and speed up commercialization.
The partnership targets the growing demand for energy-efficient AI infrastructure, where advanced packaging plays a critical role in enabling higher-performance chip architectures and heterogeneous integration.
Applied Materials said the collaboration will provide system designers with earlier access to new packaging technologies and manufacturing capabilities for future AI devices.
