Intel names packaging chief
Intel has appointed semiconductor veteran Seok-Hee Lee as executive vice president to lead its foundry packaging and system integration efforts as demand for advanced packaging continues to grow.
Intel has appointed Seok-Hee Lee as executive vice president, tasking the former SK hynix executive with leading the company's contract chip manufacturing, advanced packaging and system integration operations.
Lee will oversee Intel Foundry's back-end technology development and manufacturing activities, reflecting the growing strategic importance of advanced packaging in next-generation semiconductor designs.
The appointment comes as chipmakers increasingly rely on heterogeneous integration, chiplet architectures and high-bandwidth memory (HBM) to deliver performance gains for artificial intelligence and high-performance computing applications.
Intel has positioned advanced packaging as a key differentiator for its foundry business, offering technologies that enable multiple dies and components to be integrated into a single package.
The company is competing with major foundry players as demand grows for advanced packaging solutions capable of supporting increasingly complex AI systems.
Lee brings decades of semiconductor industry experience, including leadership roles at SK hynix and SK On, and is expected to help accelerate Intel's efforts to expand its foundry and packaging capabilities.
The move underscores the industry's broader shift towards advanced packaging as a critical technology for future semiconductor performance and system integration.
