Lam Research targets packaging growth
Lam Research expects advanced packaging revenue to grow by more than 50% in 2026, driven by demand for AI accelerators, high-bandwidth memory and chiplet-based architectures.
Lam Research is positioning advanced packaging as a key growth engine, forecasting revenue from the segment to increase by more than 50% in 2026 as AI-driven semiconductor demand accelerates.
The semiconductor equipment supplier said growing adoption of AI processors, high-bandwidth memory (HBM) and chiplet architectures is creating new opportunities for advanced packaging technologies.
Which are becoming increasingly important for boosting performance and bandwidth in next-generation computing systems.
The company is expanding its focus beyond its traditional etch and deposition businesses as advanced packaging becomes a larger part of semiconductor manufacturing investment.
However, Lam faces growing competition from rivals such as Applied Materials and KLA, which are also increasing their presence in packaging, inspection and process control technologies.
The outlook highlights the industry's broader shift towards heterogeneous integration and advanced packaging as chipmakers seek new ways to improve performance beyond conventional transistor scaling.
