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Streamlining the concept to production journey as advanced packaging gains momentum Percy Gilbert, Senior Vice President of Engineering at Skywater Technology, discusses how the company supports customers working on novel process modules, new materials, and emerging technologies before standards or volume production exist via its Technology-as-a-Service (TaaS) model. This includes advanced sensing, heterogeneous integration, and quantum-adjacent systems. His colleague, Ross Miller, Chief Strategy Officer, shares some expert insights on advanced packaging services - specifically chiplets, 2.5/3D integration, packaged optics and quantum computing - an industry that could reach $80 billion by 2030 as chips expand beyond data centre applications. 0:00 / 0:00

Recent Interviews

Streamlining the concept to production journey as advanced packaging gains momentum Percy Gilbert, Senior Vice President of Engineering at Skywater Technology, discusses how the company supports customers working on novel process modules, new materials, and emerging technologies before standards or volume production exist via its Technology-as-a-Service (TaaS) model. This includes advanced sensing, heterogeneous integration, and quantum-adjacent systems. His colleague, Ross Miller, Chief Strategy Officer, shares some expert insights on advanced packaging services - specifically chiplets, 2.5/3D integration, packaged optics and quantum computing - an industry that could reach $80 billion by 2030 as chips expand beyond data centre applications.

Addressing critical advanced packaging challenges in chipmaking Ming Li, vice president of strategic projects (dielectrics), Deposition Product Group at Lam Research, discusses the recent launch of the company’s VECTOR® TEOS 3D - a breakthrough dielectric film deposition system developed specifically for advanced packaging, as part of Lam’s broader portfolio – which is currently installed (or being installed) at leading logic and memory fabs. Ming Li highlights the innovative capabilities of the new solution: delivers thick, high-quality dielectric films void-free, high-aspect ratio performance, proprietary wafer clamping for high-bow wafers, backed by Lam’s deposition and integration expertise.

Advanced microscopy innovation meets the demands of AI and 3D packaging Dr Thomas Rodgers, senior director and head of electronics marketing at ZEISS Microscopy, discusses the forthcoming International Symposium for Testing and Analysis, or ISTFA, taking place in Pasadena, California, November 16-20th. He outlines the company’s presence at the event, where the focus is on heterogeneous computing and advanced packaging – playing to ZEISS’s technical expertise and innovation strengths when it comes to advanced failure analysis solutions (both current and planned for 2026) required for this era of AI.

High-power, high-performance semiconductor packaging design expertise Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing for the delivery of cost-effective, customizable and cutting-edge solutions. He also covers advances in Sarcina’s photonic package design capabilities for Co-Packaged Optics (CPO).

DRAM and NAND developments drive memory market Jeongdong Choe, Senior Technical Fellow, SVP at TechInsights discusses the semiconductor information platform’s Memory Outlook Report 2026, which highlights a number of trends, including the major focus on DRAM, high bandwidth memory (HBM) and 3D NAND, alongside innovations such as High Bandwidth Flash, new wordline materials and strairless wordline structure, embedded and emerging memory market developments and the impact of tariffs.

Thermal management key to mastering advanced packaging opportunities Evelyn Weng, Product Marketing Manager at ERS electronic, provides valuable insights into the company’s expertise in providing technology solutions for some of the semiconductor industry’s key advanced packaging challenges – in particular, fan-out and panel level packaging, and warpage correction. In addition to covering ERS’s thermal management solutions, Evelyn also discusses the company’s expansion roadmap, which has seen the opening of a new production, R&D and Competence Centre in Germany and a new demonstration centre in Taiwan.

AI Is Changing Chip Packaging - Here’s How Forge Nano Is Solving It In this interview, Tyler J. Myers, Technical Sales Engineer at Forge Nano, Inc., discusses Forge Nano’s role in the semiconductor and advanced packaging space. He explains how the company is addressing key challenges in advanced packaging, including material performance and process scalability, and how demand is evolving with the growth of AI and high-performance computing. Myers highlights recent innovations from Forge Nano that are enabling next-generation packaging solutions and shares his perspective on how the industry is expected to evolve in the coming years. He also outlines what he is most looking forward to discussing at Advanced Packaging International and why these insights are valuable for the broader semiconductor ecosystem.

Tyndall with Advanced Packaging In this interview, Peter O’Brien, Head of Research for Photonics Packaging and Systems Integration at Tyndall National Institute, discusses Tyndall’s role in advancing advanced packaging for photonic and semiconductor systems. He highlights key industry trends, collaboration with partners, and the challenges of scaling innovations from research to manufacturing. O’Brien also shares insights into energy-efficient system development and the breakthroughs shaping the future of advanced packaging.

Assessing the opportunity and impact of advanced packaging innovation Lee Chee Ping, Managing Director, Strategic Marketing, Advanced Packaging, Lam Research Corporation, provides detailed insights into advanced packaging innovations within the global semiconductor industry (and the trends driving this work), focusing on the strengths of Asia-led R&D, equipment and materials, foundry/OSAT manufacturing and ecosystem partnerships, discussing some of the core process challenges and explaining how Lam Research is helping to address them.