Foxconn, Radiall and Thales launch Tessalia
The new joint venture aims to produce more than 50 million System-in-Package components annually by 2033, strengthening Europe’s advanced packaging ecosystem.
Foxconn, Radiall and Thales have officially launched Tessalia Technology SAS, a new joint venture focused on outsourced semiconductor assembly and testing (OSAT), marking a significant step in expanding Europe’s advanced packaging capabilities.
The companies laid the foundation stone for the future facility in Le Barp, France, during the Choose France 2026 Summit.
The site will focus on advanced System-in-Package (SiP) technologies for aerospace, telecom infrastructure, automotive and medical applications.
Tessalia plans to begin production by the end of 2029 and aims to manufacture more than 50 million SiP components annually by 2033.
The project is expected to support an investment exceeding €250 million and create around 800 jobs at full production capacity.
According to the partners, the venture will use advanced encapsulation technologies designed to enable ultra-high-density packaging, helping reduce PCB complexity while improving component size, weight and integration capabilities.
The initiative forms part of broader European efforts under the EU Chips Act to strengthen semiconductor sovereignty and reduce dependence on global backend semiconductor supply chains.
Foxconn, Radiall and Thales said the project is intended to establish a competitive European packaging ecosystem capable of supporting future semiconductor and AI-driven electronics demand.
