Manz Asia ships PLP tool
Manz Asia has delivered what it says is the world's first 310mm × 310mm panel-level packaging electrochemical deposition production system, targeting advanced packaging applications for AI, HPC and memory devices.
Manz Asia has delivered a 310mm × 310mm panel-level packaging (PLP) electrochemical deposition (ECD) system to a customer production line, marking what the company describes as the first mass-production deployment of its kind.
The system is designed to support advanced packaging architectures including fan-out panel-level packaging (FOPLP), chip-on-panel-on-substrate (CoPoS) and through-glass via (TGV) technologies.
It can process both glass and metal square carriers and integrates wet chemical process modules used in redistribution layer (RDL) fabrication.
According to Manz Asia, the 310mm × 310mm format offers advantages in panel utilisation, scalability and production yield, making it suitable for AI, high-performance computing, high-bandwidth memory and high-speed interconnect applications.
The ECD platform forms part of the company's Omni x-series, which also includes 510mm × 515mm and 700mm × 700mm panel formats.
The modular architecture is intended to support process development, qualification, pilot production and high-volume manufacturing across a range of packaging requirements.
Manz Asia said the deployment reflects growing demand for advanced packaging equipment capable of supporting volume production as AI-driven semiconductor applications increase packaging complexity.
The company plans to continue expanding its ECD and wet process technology portfolio to support next-generation packaging technologies and manufacturing scale-up.
