SK hynix to double wafer capacity
Company targets major expansion amid ongoing HBM shortages and accelerating AI infrastructure demand.
SK hynix will double its wafer production capacity over the next five years as it moves to address rising demand for high-bandwidth memory (HBM) driven by AI data centres, according to SK Group Chairman Chey Tae-won.
Speaking at Computex 2026 in Taipei, Chey said the expansion reflects the growing memory bottleneck expected to persist through 2030, as AI workloads continue to outpace global supply.
He added that building new fabs remains a long-term and capital-intensive process, typically requiring at least three years to complete.
The company is investing in new facilities, including its M15X fab, an advanced packaging and test facility in Cheongju, and a semiconductor cluster in Yongin.
SK hynix is also expanding its advanced packaging footprint in the United States.
Industry observers note that rising demand for HBM is reshaping memory supply dynamics, with larger and more complex chips reducing the number of units produced per wafer compared to conventional DRAM.
This is expected to tighten overall DRAM supply as more capacity shifts toward HBM production.
Chey also cautioned that rapid memory price increases could affect the long-term stability of the AI ecosystem, even as demand continues to surge.
The remarks were made during a meeting with NVIDIA CEO Jensen Huang, highlighting the strategic importance of HBM supply for next-generation AI platforms and accelerator systems.
