ASE advances panel-level packaging
ASE has unveiled an automated 310mm × 310mm panel-level packaging production line aimed at scaling AI and HPC packaging for next-generation heterogeneous integration.
ASE has announced the development of an automated 310mm × 310mm panel-level packaging production line, marking a major step toward large-scale manufacturing for advanced AI and high-performance computing packages.
The new platform supports FOCoS and FOCoS-Bridge packaging technologies and is designed to accelerate the industry transition from wafer-level to panel-level packaging while maintaining consistent design rules across platforms.
According to ASE, the panel-level approach enables significantly larger usable processing areas, improving material utilisation, throughput and manufacturing efficiency for increasingly complex multi-die architectures.
The production line supports line and space capabilities of 2/2µm and 8/8µm, targeting applications including AI accelerators, HPC, networking and edge AI systems where larger package sizes and higher I/O density are becoming critical requirements.
ASE said panel-level manufacturing will help address growing challenges linked to larger interposers, chiplet integration and high-bandwidth memory scaling as the industry moves toward trillion-transistor system-in-package architectures.
The company expects the automated panel-level packaging line to enter production in the first half of 2027.
