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Please note that if you are interested in submitting editorial , then it should have the following framework:
Headline: Five or six words that capture the key packaging, integration, or manufacturing achievement
Opening line(s): A concise statement of the breakthrough and who achieved it. This should be no more than two sentences and clearly explain the significance of the work.
First section: Explain why this development matters. What impact could it have on semiconductor packaging, heterogeneous integration, chiplet architectures, system performance, thermal management, manufacturing efficiency, reliability, yield, or cost? Focus on the broader industry implications.
Second section: Put the work into context. What challenge or limitation does it address? If a record has been achieved or a milestone reached, explain what makes it noteworthy and what technical innovation enabled the advance.
Third section: Provide technical details. Describe the packaging technology, process flow, materials, equipment, design approach, test vehicle, interconnect architecture, thermal solution, bonding technique, substrate technology, or manufacturing method used. Include relevant performance, reliability, yield, thermal, electrical, or mechanical results where appropriate.
Fourth section: Discuss future developments. How can the technology be improved, scaled, commercialised, or integrated into future products? What is the next research or development steps?
Final section: Include a reference to the published paper, conference presentation, technical report, or indicate where the work will be published or presented.
We want the article to be concise and accessible to industry professionals. The target length is approximately 1200 words, with an upper limit of 1800 words.
Articles may include one or two diagrams, figures, process flow illustrations, package cross-sections, performance graphs, or microscopy images that help explain the work.
To give you a flavour of the type of content we publish, you may wish to review recent articles in Advanced Packaging.
Please note that we may edit submissions for style, clarity, and length. Authors will have the opportunity to review any significant editorial changes prior to publication.
Once you have written your article, please send it to: [email protected]
If you would like more information about our editorial guidelines, please contact [email protected]