Malaysia seeks Japan chip partnership
Prime Minister Anwar Ibrahim highlighted advanced packaging, assembly and testing as key areas for deeper Malaysia-Japan cooperation as both countries seek to strengthen regional semiconductor supply chains.
Malaysia and Japan can play a significant role in building more resilient semiconductor supply chains by combining their complementary strengths in the industry, Malaysian Prime Minister Anwar Ibrahim said during a visit to Tokyo on June 10.
Speaking at the Nikkei Forum, Anwar said Malaysia's capabilities in assembly, testing and advanced packaging align closely with Japan's leadership in semiconductor materials, manufacturing equipment and advanced production technologies.
"This is where Malaysia and Japan can make a meaningful contribution," he said, describing opportunities to create more integrated and resilient technology ecosystems across Asia.
The remarks come as governments and industry players seek to diversify semiconductor supply chains amid rising geopolitical tensions and growing demand for AI-related hardware.
Anwar also pointed to opportunities for collaboration in artificial intelligence and clean energy, while highlighting the role Japanese companies played in helping establish Malaysia's semiconductor industry.
The comments reinforce Malaysia's ambition to expand its position in advanced packaging and higher-value semiconductor manufacturing through partnerships with technology leaders such as Japan.
