Event Calendar

Here you will find up and coming events and webinars related to the Advanced Packaging Industry.


17th June 2026     19th June 2026

Hilton Dresden Hotel, Germany



SEMI 3D and Systems Summit 2026


The SEMI 3D and Systems Summit 2026 takes place in Dresden, Germany from June 17 to 19, bringing together semiconductor and packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration. Expert-led sessions cover chiplet architectures, hybrid bonding, co-packaged optics, AI-driven system architectures, and AR/VR and wearable intelligence, with a strong focus on Europe's role in advancing design leadership, materials innovation, and the transition from lab to fab.
2nd August 2026     7th August 2026

Jeju, Korea.



3rd International Conference on AI Sensors and Transducers (AIS 2026)


Mark Your Calendars! The much-anticipated 3rd International Conference on AI Sensors and Transducers (AIS 2026) will be held from 2–7 August 2026 in Jeju, Korea. Present your Research: This is a great opportunity for engineers, scientists and tech innovators to showcase their research in the exciting field of AI-enhanced sensing systems, IOT devices, sensors and transducers. Find out more about the AIS 2026 conference here: https://sciforum.net/event/AIS2026 Showcase your Innovations and Network: We have exhibition booths and sponsorship opportunities for start-ups and tech companies looking to showcase their services and products. Please contact the AIS 2026 organizers for more information on sponsorships: [email protected]