Amtech sees AI packaging boost
AI-driven demand for advanced packaging equipment is fueling order growth at Amtech Systems, as the company expands its portfolio for higher-density and panel-level packaging applications.
Amtech Systems says rising demand for AI semiconductor packaging is driving growth across its Thermal Processing Solutions business, with AI-related sales accounting for more than 30% of segment revenue in the second quarter of fiscal 2026 and expected to exceed 40% in the current quarter.
The company attributes the momentum to expanding investments by semiconductor manufacturers and outsourced semiconductor assembly and test (OSAT) providers as they increase capacity for AI infrastructure.
Amtech is also investing in next-generation equipment for higher-density and panel-level packaging, aiming to broaden its addressable market beyond fiscal 2026.
The company said its thermal processing technologies help customers improve manufacturing yields for increasingly complex AI devices.
The AI-driven demand is reflected in commercial activity, with Thermal Processing Solutions reporting a 61% year-over-year increase in new orders and a 25% rise in backlog during the second quarter, led by customers in Asia.
Looking ahead, Amtech expects third-quarter fiscal 2026 revenue of $20.5 million to $22.5 million, supported by continued demand for equipment used in advanced semiconductor packaging.
