AOS unveils AmpStack power packaging
New vertically stacked MOSFET package boosts power density and efficiency for AI, industrial and power conversion applications.
Alpha and Omega Semiconductor (AOS) has introduced AmpStack, a new advanced packaging technology designed to increase power density and improve switching performance in next-generation power conversion systems.
The company’s first AmpStack-based product, the AOPL66801 80V MOSFET, integrates two vertically stacked dies in a half-bridge configuration within a compact DFN6x5 package.
The design is intended to maximise PCB space while reducing parasitic inductance compared with conventional discrete MOSFET solutions.
By combining the high-side and low-side MOSFETs into a single package, AmpStack enables more compact power designs for applications ranging from AI data centre power systems to industrial equipment and power tools.
An optimised clip design further reduces phase-node voltage ringing and minimises electrical stress on the MOSFETs, improving system reliability.
The package also incorporates a Kelvin sense pin to improve gate-drive stability during high-speed switching, while supporting a maximum junction temperature of 175°C for demanding operating environments.
“Our new AmpStack half-bridge packaging is a game-changer for designers looking to increase power density,” said Peter H. Wilson, Senior Director of the MOSFET Product Line at AOS.
“By designing the package for low source parasitic inductance, we’ve significantly reduced phase-node ringing and MOSFET stress, delivering higher reliability alongside increased power.”
As demand grows for higher-efficiency power delivery in AI infrastructure and other high-performance applications, innovations in advanced semiconductor packaging are becoming increasingly important.
AmpStack extends vertical die-stacking techniques to power semiconductors, enabling higher integration levels while improving electrical and thermal performance.
