AI packaging boom drives investments
LG Chem, Asahi Kasei and Sumitomo Chemical are expanding their advanced semiconductor packaging materials businesses as demand rises for AI chips, HBM, chiplets and high-performance computing systems.
Major chemical suppliers are accelerating investments in next-generation packaging materials, targeting technologies critical to future AI and data center growth.
LG Chem has entered the semiconductor stripper market after qualifying as a supplier for Amkor Technology, strengthening its electronic materials portfolio.
The company is expanding its focus on high-value semiconductor materials, including packaging adhesives, low-dielectric materials, thermal management solutions and glass substrate technologies, as part of its broader R&D strategy.
Asahi Kasei has completed a new SUNFORT™ dry film photoresist slitting line at its Tainan, Taiwan facility, increasing capacity to support advanced semiconductor packaging demand.
The company is also developing new packaging materials, including dry film photoresists for AI servers and photosensitive polyimide films for redistribution layers and substrate insulation applications.
Sumitomo Chemical is moving deeper into next-generation packaging through a joint venture with Samsung Electro-Mechanics to develop glass core substrates.
The new company, Glassem, will focus on the research, production and sales of advanced glass substrates, aiming to establish a commercial supply system from 2027.
Glass core substrates are emerging as a key technology for future AI and high-performance computing packages due to their dimensional stability, low warpage and ability to support high-density wiring.
Companies including Intel, TSMC and several Asian suppliers are advancing glass substrate development as demand grows for larger and more complex AI chip packages.
Meanwhile, Chinese companies are also expanding their glass substrate capabilities, with firms such as BOE, Lens Technology and Dinglong developing TGV processes, glass substrate production lines and supporting consumables.
The wave of investment highlights a broader shift in the semiconductor industry, where advanced packaging materials are becoming a critical bottleneck and a major growth opportunity as AI-driven computing demand accelerates.
