ACCM unveils silicon-matched core
New production-ready substrate core aims to reduce warpage and improve reliability for large chiplet-based AI and high-performance computing packages without requiring new manufacturing infrastructure.
Advanced Chip and Circuit Materials (ACCM) has introduced Celeritas SMC (Silicon-Matched Core), a production-ready substrate core designed to address thermal expansion challenges in next-generation advanced semiconductor packages.
Available from the company’s Wisconsin manufacturing facility, the new material is engineered to match the in-plane coefficient of thermal expansion (CTE) of silicon while remaining compatible with existing organic substrate manufacturing lines.
The approach is intended to support large-body chiplet packages, embedded bridge architectures and other advanced package designs where conventional organic cores are increasingly limited by warpage and thermomechanical stress.
Unlike glass-core substrates, which require specialised through-glass vias and dedicated manufacturing processes, Celeritas SMC is designed to work with standard mechanical and laser drilling, metallisation and lamination techniques.
This enables substrate manufacturers to adopt silicon-matched core technology without significant capital investment or production line changes.
In addition to its silicon-matched CTE, the material offers high stiffness, low moisture absorption and low dielectric loss, making it suitable for high-performance AI and HPC applications where signal integrity and reliability are critical.
“The industry does not have a low CTE problem; it has a low CTE at acceptable cost problem,” said Tarun Amla, Founder, President and CEO of ACCM. “Celeritas SMC gives packaging engineers silicon-matched CTE, high stiffness and low loss on the equipment they already own.”
The launch comes as advanced packaging continues to evolve towards larger chiplet-based architectures that require improved thermal management and substrate stability.
By offering a production-ready alternative to glass-core technology, ACCM aims to simplify the transition to next-generation package designs while supporting existing manufacturing infrastructure.
