Nova WMC wins foundry adoption
Nova has announced that its Nova WMC™ platform has been selected by a leading global foundry customer for measurement across multiple layers in advanced packaging processes.
Following a competitive evaluation, the platform has been designated as the customer's tool of record.
The selection is expected to support several advanced packaging production flows and create additional deployment opportunities as the foundry expands manufacturing capacity.
Nova also reported growing adoption of the WMC™ platform across multiple memory and foundry customers, reflecting increasing demand for advanced metrology solutions in semiconductor packaging.
Designed to address the challenges of advanced packaging, the Nova WMC™ platform features a modular architecture capable of measuring complex structures with high warpage, non-symmetrical shapes and varying surface conditions within a single system.
The platform combines high-throughput operation with fast, repeatable scanning and large-area mapping at nanometre-level fidelity to support process control in high-volume manufacturing.
As packaging technologies become more complex, accurate metrology is playing an increasingly important role in improving yield and ensuring process consistency for applications such as high-bandwidth memory (HBM) and advanced heterogeneous integration.
"Following a successful introduction, Nova WMC™ is now entering a rapid growth phase," said Gaby Waisman, President and CEO of Nova Ltd.
"Customer adoption across advanced packaging and HBM applications underscores the platform's value and positions us to scale as demand accelerates.
This latest selection by a leading customer further expands adoption of our portfolio, reinforcing our position as a trusted partner."
The latest customer win strengthens Nova's position in the advanced packaging metrology market, where demand for precise measurement solutions continues to grow alongside the industry's adoption of increasingly sophisticated packaging architectures.
