JCET invests $1.15B in packaging expansion
China's largest semiconductor packaging and testing provider will build a new advanced packaging and testing facility in Shanghai to support growing demand from AI, HPC and networking applications.
JCET Group has announced plans to invest 7.8 billion yuan ($1.15 billion) in a new advanced semiconductor packaging and testing facility in Shanghai, reinforcing its position in the rapidly growing advanced packaging market.
The project will be developed in two phases, with the first phase covering plant construction and equipment installation and scheduled for completion in the second half of 2028. Capacity expansion in the second phase will be driven by market demand.
The investment is aimed at accelerating JCET’s deployment of high-end advanced packaging technologies and strengthening its competitiveness in applications such as artificial intelligence, high-performance computing and networking.
Advanced packaging has become a critical enabler of next-generation semiconductor performance, allowing multiple chips to be integrated into a single package to deliver higher bandwidth, improved power efficiency and greater computing capability.
Industry analysts view the expansion as a strategic move that positions JCET to benefit from increasing domestic demand for AI and HPC devices while supporting China’s broader efforts to strengthen its semiconductor supply chain.
The company reported first-quarter revenue of approximately 9 billion yuan, with net profit rising more than 40% year-on-year.
