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Wooptix installs Phemet at CEA-Leti

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The deployment marks the first industrial installation of Wooptix's Phemet platform, supporting advanced packaging metrology and process control research at CEA-Leti.

Wooptix has installed the first production deployment of its Phemet® semiconductor metrology system at CEA-Leti in Grenoble, strengthening collaboration on advanced packaging process control and wafer-scale metrology.

Installed in May 2026, the automated 300 mm platform will operate within CEA-Leti's semiconductor cleanroom, where the partners will jointly evaluate applications including wafer-shape measurement, nanotopography and advanced packaging metrology.

The collaboration was highlighted during CEA-Leti Innovation Days 2026.

The deployment represents a significant milestone for Wooptix as it expands its semiconductor metrology portfolio towards high-volume manufacturing applications.

The company will use the collaboration to validate its technology in product-relevant semiconductor processes and develop new process-control applications.

Phemet, introduced in late 2025, uses Wooptix's proprietary wavefront phase imaging (WFPI) technology to deliver sub-nanometre wafer geometry measurements at high speed.

The platform is designed to improve process control as semiconductor manufacturers adopt increasingly complex device architectures and advanced integration technologies.

CEA-Leti will evaluate the system's capabilities for industrial-scale metrology while supporting research projects focused on next-generation advanced packaging technologies.

According to Wooptix CEO José Manuel Ramos, the installation is a key step towards qualifying the platform for high-volume semiconductor manufacturing while strengthening the company's presence in Grenoble, one of Europe's leading semiconductor research hubs.

The collaboration also provides CEA-Leti with a fully automated metrology platform for investigating nanoscale process variations and supporting European research initiatives in advanced semiconductor manufacturing.

As advanced packaging technologies such as hybrid bonding and heterogeneous integration demand tighter control of wafer flatness and surface topography, high-resolution metrology is becoming an increasingly important part of semiconductor process development.