EVG showcases advanced packaging at ECTC
EV Group will present hybrid bonding, metrology and layer transfer technologies for 3D integration at ECTC 2026.
EV Group will showcase its latest advanced packaging and heterogeneous integration solutions at the 2026 IEEE Electronic Components and Technology Conference in Orlando, Florida.
The portfolio includes hybrid bonding systems, die-to-wafer metrology, layer transfer technology and maskless lithography tools aimed at supporting AI, high-performance computing and advanced memory applications.
Key platforms on display include the GEMINI FB wafer bonding system, EVG40 D2W metrology system, IR LayerRelease technology and the LITHOSCALE XT maskless exposure system.
The company will also contribute to multiple technical sessions covering hybrid bonding, advanced interconnects, materials integration and laser-based processes for next-generation packaging.
EV Group said demand from AI and data-intensive computing is accelerating the need for scalable heterogeneous integration technologies, with hybrid bonding and advanced lithography playing a central role in future chip architectures.
