ECTC 2026 highlights AI packaging trends
The annual IEEE ECTC conference will bring together more than 2,000 industry professionals to discuss the latest advances in advanced packaging, heterogeneous integration, photonics and AI infrastructure.
The 76th IEEE Electronic Components and Technology Conference (ECTC) will take place from May 26–29, 2026 in Orlando, Florida, bringing together the global semiconductor packaging community for four days of technical presentations, industry discussions and networking.
Organised by the IEEE Electronics Packaging Society, ECTC 2026 will feature more than 450 technical papers across 41 sessions, alongside special sessions, professional development courses, startup activities and student competitions focused on next-generation packaging technologies.
This year’s conference places strong emphasis on artificial intelligence infrastructure and system-level integration, with topics spanning wafer-level and fan-out packaging, 2.5D and 3D integration, advanced substrates, photonics, quantum electronics, reliability and high-bandwidth interconnects.
A keynote address from Dr. Tien Wu, CEO of ASE, will explore how advanced packaging is evolving into a core enabler of AI-era system optimisation through heterogeneous integration and packaging-driven co-design.
The conference will also host a series of special sessions covering areas such as photonics-based systems for AI and exascale computing, panel-level packaging, AI-enabled electronic design automation, thermal-mechanical co-design and chiplet-era substrate technologies.
ECTC 2026 additionally includes startup and student innovation initiatives, reflecting broader industry efforts to accelerate talent development and emerging technology commercialisation across the semiconductor packaging ecosystem.
