Amkor expands Arizona footprint
Additional 67-acre acquisition strengthens plans for large-scale U.S. semiconductor packaging and test operations targeting AI, HPC, automotive and communications markets.
Amkor Technology has secured an additional 67 acres adjacent to its upcoming manufacturing campus in Peoria, Arizona, expanding its long-term capacity plans for advanced semiconductor packaging and testing in the United States.
The new land parcel adds to the company’s existing 104-acre site within Peoria’s Innovation Core and supports the development of what Amkor describes as the first high-volume advanced packaging outsourced semiconductor assembly and test (OSAT) facility in the U.S.
The expansion comes amid rising demand for domestic semiconductor manufacturing and advanced packaging capabilities driven by artificial intelligence, high-performance computing, automotive electronics and communications infrastructure.
According to the company, the larger footprint will provide additional flexibility for future scaling as customers increasingly seek geographically diversified and resilient supply chains.
“Our continued expansion in Arizona strengthens our ability to support customers with leading-edge packaging and test solutions while contributing to a more resilient global supply chain,” said Kevin Engel, president and chief executive officer of Amkor Technology.
The move further highlights growing momentum behind advanced packaging investment in the U.S., as OSAT providers and semiconductor manufacturers expand local capabilities to support next-generation AI and chiplet-based architectures.
