GlobalFoundries launches SCALE CPO platform
New silicon photonics solution targets high-bandwidth optical interconnects for next-generation AI data centres.
GlobalFoundries has introduced its SCALE optical module solution for co-packaged optics (CPO), targeting next-generation AI data centre interconnects.
The Silicon photonics Co-packaged Advanced Light Engine (SCALE) platform is designed to support high-bandwidth, energy-efficient optical connectivity for AI scale-up architectures and exceeds current OCI MSA optical interconnect requirements.
Built on the company’s silicon photonics technology, the platform combines coarse and dense wavelength-division multiplexing for bi-directional optical transmission, enabling improved bandwidth density and scalability compared with traditional copper interconnects.
The solution also integrates advanced packaging technologies including through-silicon vias, fine-pitch copper pads and support for 2.5D and 3D stacking architectures.
GlobalFoundries said the platform is intended to accelerate adoption of co-packaged optics as AI infrastructure continues to drive demand for higher performance and lower power optical interconnects.
