IC-link joins TSMC 3DFabric alliance
Imec’s ASIC and silicon photonics division expands access to advanced packaging and 3D IC integration technologies.
IC-Link by imec has joined TSMC’s Open Innovation Platform 3DFabric Alliance, expanding its capabilities in advanced packaging and 3D integrated circuit development for AI, HPC, automotive and telecommunications applications.
The alliance provides ecosystem partners access to TSMC’s 3DFabric technologies, including SoIC, CoWoS, InFO and SoW platforms, supporting heterogeneous integration and multi-die system design.
Imec said the collaboration strengthens IC-Link’s ability to support customers developing next-generation ASIC and silicon photonics solutions requiring advanced chip integration and high-volume manufacturing readiness.
The company noted that as AI and memory-intensive workloads continue to scale, advanced packaging has become a critical factor in improving system performance, power efficiency and time-to-market.
The partnership also reinforces imec’s broader focus on heterogeneous integration and system scaling, linking research and industrial implementation across the semiconductor ecosystem.
