NHanced targets fine-pitch bonding
NHanced Semiconductors, Besi and the University of Florida will present research on the technical challenges of scaling ultra-fine-pitch hybrid bonding for AI, HPC and heterogeneous integration.
NHanced Semiconductors, semiconductor equipment supplier Besi and researchers from the University of Florida will present research on the challenges of implementing ultra-fine-pitch hybrid bonding at the 2026 IMAPS Symposium in Boston.
The paper, titled “Technical Challenges for Ultra Fine Pitch Hybrid Bonding,” will examine the process and equipment requirements for achieving the high-density interconnects needed in next-generation heterogeneous packages.
Hybrid bonding is increasingly being adopted for advanced packaging because it enables direct copper-to-copper connections at fine pitches, reducing interconnect length and enabling higher connection densities than conventional solder-based approaches.
The technology is being explored for chiplets, 2.5D and 3D integration, advanced memory and other high-performance architectures.
However, further pitch scaling introduces challenges across materials, process integration, equipment and reliability. The research will examine issues including alignment accuracy, surface preparation and thermal management, which become increasingly critical as bonding dimensions shrink.
These challenges are particularly important for heterogeneous systems that combine dies manufactured using different process technologies and materials.
Such architectures can bring together logic, memory, photonics and RF devices within a single package, increasing the complexity of bonding and process integration.
The work will also examine emerging process solutions and equipment developments aimed at enabling ultra-high-density interconnects for AI and high-performance computing.
NHanced Semiconductors operates an advanced packaging foundry focused on technologies including chiplets, 3D ICs, silicon interposers, 2.5D integration and photonics.
Besi provides semiconductor assembly equipment, while the Florida Semiconductor Institute at the University of Florida conducts research and development across semiconductor technologies.
The 2026 IMAPS Symposium, themed “Intelligent Packaging for the AI Era; Heterogeneous Integration and Photonics,” will take place from September 28 to October 1 in Boston, Massachusetts.
