WEISUN targets FOPLP thermal processing
WEISUN Industrial has introduced a dedicated 310 × 310 mm chamber configuration of its AQWOL-5S Smart Clean Room and Inert Gas Oven for fan-out panel-level packaging (FOPLP), targeting OSATs and advanced packaging substrate manufacturers.
The new configuration is designed around a single-panel format and is intended to provide tighter control of the curing and annealing processes used in advanced packaging. These thermal processes can contribute to panel warpage and alignment errors, making temperature and atmospheric control important factors in packaging yield.
The AQWOL-5S operates from room temperature to 200°C in a Class 100 clean environment, with oxygen levels maintained below 50 ppm during processing. The 310 mm configuration uses an eight-zone automatic damper system to regulate airflow and specifies temperature uniformity of ±3°C.
The system is designed for processing materials including polyimide (PI), benzocyclobutene (BCB) and polybenzoxazole (PBO), with cooling options including air cooling using nitrogen or CDA, as well as water cooling.
WEISUN also offers its W-AIMS monitoring platform, which uses machine learning to monitor airflow-related parameters including HEPA filter pressure differential, chamber airtightness, damper behaviour and ventilation efficiency. The system can provide maintenance recommendations based on configurable operating limits.
For production environments, the oven supports SECS/GEM and CIM integration, as well as automated handling through AMR or conveyor-based robotics, enabling process data and operating conditions to be monitored and recorded for traceability.
The company says the new configuration is intended to address the thermal processing requirements emerging as panel-level packaging moves toward higher-volume manufacturing.
