Manz Asia and SUSS advance Inkjet
Manz Asia and SUSS have announced a strategic collaboration to develop next-generation inkjet solutions for semiconductor manufacturing, with a focus on advanced packaging and panel-level packaging (PLP).
The partnership combines Manz Asia’s inkjet printing and manufacturing expertise with SUSS’ semiconductor process capabilities and global customer reach.
The companies aim to accelerate the development and commercialisation of inkjet processes as semiconductor packaging moves towards greater integration, more complex structures and larger processing formats.
Inkjet printing is gaining interest as an alternative or complement to conventional coating processes because it enables precise, selective deposition of materials while potentially reducing material consumption.
The technology can also support deposition across complex three-dimensional structures, making it relevant to emerging advanced packaging processes.
Under the collaboration, Manz Asia and SUSS will explore new semiconductor inkjet applications, validate materials and processes, and develop approaches suitable for scalable manufacturing.
Manz Asia will contribute its inkjet technology, manufacturing engineering capabilities and experience in the panel-level packaging ecosystem, while SUSS will provide semiconductor process expertise and market access.
A key objective is to establish a path from process development to high-volume manufacturing. Manz Asia's Lab-to-Fab approach covers material and substrate preparation, printing, curing and process characterisation, providing a framework for evaluating and optimising inkjet processes before production deployment.
The collaboration also strengthens SUSS' position in next-generation coating technologies. The company identifies semiconductor inkjet as an emerging growth area, with applications extending across advanced packaging and other high-value semiconductor manufacturing processes.
For advanced packaging manufacturers, the technology could offer greater process flexibility and material efficiency as package structures become more complex.
The partnership is also significant for PLP, where larger substrates and panels are driving demand for manufacturing processes that can deliver uniformity, throughput and scalability.
Manz Asia already has a portfolio spanning inkjet printing, electrochemical deposition and wet-processing technologies for panel-level packaging. Its platforms support applications including redistribution-layer manufacturing for FOPLP, CoPoS and glass-core technologies.
The collaboration between the two companies therefore reflects a broader move towards additive and digitally controlled manufacturing processes in advanced packaging, with inkjet potentially providing a more selective route for depositing functional materials as packaging architectures continue to scale.
