BTU advances fluxless reflow
BTU International has expanded its formic acid reflow technology to support fluxless soldering for advanced semiconductor packaging and high-reliability applications.
BTU International has announced the availability of formic acid reflow across multiple reflow oven platforms, targeting advanced packaging, flip-chip, wafer-level packaging and power device applications.
The technology enables fluxless soldering by creating an ultra-low-oxygen environment, reaching single-digit parts-per-million levels within the reflow chamber. This helps reduce oxidation and contamination while improving solder wetting and joint consistency.
BTU uses targeted formic acid process zones to reduce chemical consumption while maintaining oxide removal during soldering.
The capability is also compatible with BTU’s TrueFlat technology, which is designed to control substrate warpage during thermal processing. This combination is aimed at thin substrates and advanced IC packages where mechanical distortion can affect assembly yields.
BTU said the technology addresses the industry's move towards finer interconnects, thinner substrates and higher reliability requirements in next-generation semiconductor packaging.
