Nordson targets large-panel packaging
Nordson Electronics Solutions has introduced the ASYMTEK Vantage XL fluid dispensing platform for panel-level packaging (PLP), targeting manufacturers scaling advanced semiconductor packaging to larger panel formats.
The system is designed to process panels up to 510 × 515 mm, with custom tooling available for additional formats. It addresses manufacturing challenges associated with larger panels, including warpage, temperature uniformity, alignment and dispensing accuracy.
An integrated thermal management system is designed to improve underfill flow and maintain temperature uniformity across the panel, while the platform uses dual-valve IntelliJet jetting and real-time dispense correction to improve material placement and process consistency.
The Vantage XL also incorporates automated multi-fiducial recognition for panel alignment and confocal height sensing for dispensing on reflective and transparent glass panels. Integrated post-dispense inspection can identify defects and support rework, helping manufacturers reduce scrap.
The platform builds on Nordson's existing Vantage dispensing technology, which supports wafer-, substrate- and panel-level applications. It also provides automated calibration, closed-loop process controls, traceability and Industry 4.0 connectivity.
As panel-level packaging expands for applications including AI, high-performance computing and automotive electronics, the ability to maintain dispensing precision and process uniformity across larger formats is becoming increasingly important for packaging yield.
