ISDN Precision System has launched two precision motion products at Automation Taipei 2026, including a dual-gantry platform developed specifically for advanced semiconductor packaging.
The new ApexTwin MFF Dual-Gantry Motion System is designed to address growing requirements for large-format substrates, high-speed processing and precision positioning in back-end packaging equipment.
Unlike conventional single-gantry systems, ApexTwin uses a dual-gantry architecture that can execute two sets of process cycles simultaneously.
According to ISDN, the approach is intended to increase equipment throughput and operational efficiency as advanced packaging processes become larger and more complex.
The platform combines ISDN's linear motors with high-end motion controllers in a dual-drive architecture. It provides six-axis synchronous control and achieves a settling time of 50 ms at 0.1 mm within ±300 nm.
Precision and stability are further supported by an active vibration isolation system designed to filter external environmental vibrations that could affect packaging processes.
Alongside ApexTwin, ISDN has introduced its Vacuum Low-Profile High-Precision Module, aimed at semiconductor and medical equipment operating in vacuum environments.
Thermal management is a particular challenge for vacuum motion systems because the absence of air convection limits heat dissipation from moving components.
ISDN has incorporated its linear motor thermal dissipation technology into the module to maintain positioning stability under these conditions.
With a minimum single-axis profile of 33 mm, the module is designed for equipment where installation space is limited. Semiconductor applications include precision wafer inspection alignment and pre-grinding wafer alignment.
ISDN said the two products address increasing industry demand for large-format, high-speed motion and ultra-thin precision positioning as semiconductor and advanced manufacturing equipment evolves.
The company is showcasing both systems at Automation Taipei 2026, taking place from 19 to 22 August at the Taipei Nangang Exhibition Center.
