proteanTecs targets multi-die systems
New monitoring solutions provide per-chiplet visibility to improve yield, power, performance and reliability across advanced multi-die packages.
proteanTecs has launched a suite of health, power and performance management solutions designed for advanced packaging and multi-die systems.
The new capabilities use the company’s on-chip monitoring technology to provide per-chiplet visibility across production and in-field operation, helping semiconductor and system companies improve yield, reliability and performance in complex system-in-package designs.
The offering combines chiplet quality assurance, pre- and post-packaging correlation, synchronized inter-chiplet analysis and multi-stream data analytics.
It is designed to identify integration-related effects including thermal gradients, power and clock noise, structural stress and workload-dependent behaviour.
proteanTecs says the technology can also help improve known-good-die and known-good-stack quality, increase compound yield and provide greater visibility into package and power-delivery performance.
“Advanced packaging introduces subtle electrical, thermal and mechanical interactions that conventional pass-or-fail testing simply cannot reveal,” said Evelyn Landman, Co-founder and CTO of proteanTecs.
The company is already deploying the capabilities through multi-year engagements with customers developing chiplet-based and multi-die systems.
proteanTecs will also host an advanced packaging webinar with Amkor Technology on 26 August, focusing on power, performance and reliability as chiplet architectures move into volume production.
