Infinitesima advances packaging metrology
Infinitesima has appointed Priya Mukundhan as Vice President of Marketing as the UK metrology company expands its presence in advanced semiconductor manufacturing, including advanced packaging and hybrid bonding.
Mukundhan brings more than 25 years of semiconductor industry experience to the role. She previously served as Senior Director of Product Management and Product Marketing at Onto Innovation, where she worked on opto-acoustic metrology products and their commercialisation.
At Infinitesima, she will lead marketing strategy, focusing on product positioning, market development and customer engagement as the company expands applications for its metrology technologies.
The appointment comes as semiconductor manufacturers face increasing challenges in measuring complex nanoscale structures for advanced process technologies.
Infinitesima's Metron3D production metrology platform provides high-resolution three-dimensional measurements at production speed, supporting process control, yield improvement and manufacturing efficiency.
The company's Rapid Probe Microscope (RPM) uses high-speed atomic force microscopy to combine sub-nanometre resolution with production throughput. The technology is designed to characterise advanced semiconductor structures used in High-NA EUV lithography, advanced packaging and hybrid bonding.
For advanced packaging, high-resolution metrology is becoming increasingly important as manufacturers adopt finer interconnects, tighter dimensional tolerances and more complex bonding structures.
Accurate three-dimensional measurement can help identify process variations and improve control of manufacturing steps that directly affect yield and reliability.
Infinitesima said its technology is already deployed in high-volume semiconductor manufacturing, with customers including SK hynix, while the company also collaborates with organisations including imec and ASML.
Mukundhan’s appointment is intended to support the company’s next phase of growth and broaden the adoption of its metrology platforms across advanced semiconductor manufacturing.
