Imec advances superconducting photonics
Imec has demonstrated a superconducting NbTiN circuit platform that could support future photonic, quantum and high-performance computing systems, combining high-density Josephson junctions with 2.5D and 3D heterogeneous integration.
Presented at the 2026 Applied Superconductivity Conference, the platform features three metal levels of NbTiN-based Josephson junction circuits, achieving a reported design density of 3.8 million junctions per cm². Imec also demonstrated three layers of NbTiN routing with superconducting wires scaled to 30nm linewidths.
The technology is being developed using 300mm CMOS-compatible processes, with imec targeting greater scalability for superconducting electronics. The approach combines process technology, device and circuit development with system-level integration.
For photonics, the work is relevant to the emerging convergence of superconducting electronics and integrated optical systems. Imec identifies photonics among the potential application areas for its platform, alongside HPC, AI, quantum computing and neuromorphic systems.
A key part of the programme is its focus on 2.5D and 3D heterogeneous integration, allowing superconducting devices to be co-integrated with other technologies. This could provide a pathway towards systems combining superconducting processing with photonic and electronic functions.
The demonstrated circuits use NbTiN/alpha-silicon/NbTiN Josephson junctions, with junction diameters down to 150nm. The multilayer routing can incorporate structures including inductors, transmission lines, ground planes and clock or power resonators.
Imec is positioning the platform as a potential alternative for applications where conventional CMOS faces increasing energy and data-movement challenges.
The organisation estimates that superconducting technology could ultimately deliver substantial gains in energy efficiency, compute density and bandwidth, although significant challenges remain before such systems can become commercially practical.
The research therefore highlights a developing area of photonic integration in which superconducting devices, photonics and advanced heterogeneous packaging could be combined within future computing and communications architectures.
