YINCAE launches dual-cure underfill
YINCAE Advanced Materials has introduced UF 66UV, a UV- and thermal-dual-cure underfill for advanced optical and semiconductor packaging, offering room-temperature processing, high optical transparency, and robust reliability for photonic and optoelectronic applications.
YINCAE Advanced Materials has introduced UF 66UV, a UV- and thermal-dual-cure underfill developed for advanced optical and semiconductor packaging applications.
The new material is designed to support optoelectronic and photonic devices that require high optical clarity, reliable performance, and low-temperature processing.
UF 66UV is engineered to flow into ultra-fine gaps at room temperature, eliminating the need for preheating during assembly.
After dispensing, exposed areas are rapidly immobilized using UV curing, while a subsequent thermal cure at just 60°C completes polymerization in shadowed regions, helping ensure long-term mechanical reliability without exposing sensitive components to excessive heat.
The underfill offers more than 98% visible light transmittance after curing and maintains its transparency and color stability during reliability testing.
According to YINCAE, the material retained its optical performance after Pressure Cooker Test (PCT) exposure and five lead-free reflow cycles at 260°C, showing no measurable loss in light transmission, no visible yellowing, and strong adhesion and encapsulation integrity.
UF 66UV is targeted at applications including MicroLED displays, CMOS image sensors, silicon photonics, VCSEL and LiDAR modules, optical sensors, AR/VR optical assemblies, and medical and industrial optical devices.
