Tomocube has launched its HT-T1 Desktop (HT-T1D), a 3D non-destructive inspection and metrology system designed to analyze defects in glass substrates used in advanced semiconductor packaging.
As glass substrates and glass interposers gain attention for next-generation AI accelerators, high-bandwidth memory (HBM), and high-performance computing (HPC) applications, manufacturers face increasing challenges in detecting and understanding defects that can impact production yield.
The HT-T1D uses visible-light holotomography to reconstruct the internal three-dimensional structure of glass substrates, providing detailed information on defect location, morphology, and depth that conventional surface inspection methods cannot capture.
The system is designed to help manufacturers investigate defects caused during processes such as laser drilling, etching, metallization, and singulation.
Tomocube said the non-destructive approach enables repeated measurements of the same area throughout manufacturing stages, helping engineers track defect formation and improve process control.
The company claims the technology can reduce defect analysis cycles from days or weeks to minutes in applicable workflows.
Alongside the inspection hardware, Tomocube introduced TomoAnalysis MI (TAMI), a 3D analysis software platform that enables quantitative evaluation of refractive-index data and supports engineering review workflows from research and development through production.
With advanced packaging moving toward larger substrates, higher interconnect density, and greater integration of chiplets and HBM, improved metrology solutions will be critical for accelerating glass substrate adoption and achieving high-volume manufacturing yields.
