Intel targets glass packaging
The companies will collaborate on through-glass via technology to advance glass substrate packaging for AI chips and co-packaged optics.
Intel and China's Lens Technology have signed a memorandum of understanding (MoU) to jointly develop through-glass via (TGV) advanced packaging technology, targeting next-generation AI computing chips and co-packaged optics.
Under the agreement, the companies will evaluate potential projects covering key manufacturing processes, including TGV fabrication, high-precision laser processing, plated through-hole (PTH) metallization and multi-layer interconnection.
Intel will provide technical specifications and support efforts to apply the technology to AI chip packaging, while any commercial projects will be subject to separate agreements.
TGV glass substrates are attracting increasing interest as an advanced packaging platform due to their low thermal deformation, reduced signal loss, high-frequency performance and suitability for large-format packages.
The technology is considered a promising solution for AI processors, high-performance computing and co-packaged optical systems.
Lens Technology said it has established pilot production lines and sample trials for TGV precision machining, micro-hole formation, metallization and multi-layer interconnection.
The partnership is expected to accelerate the commercialisation of glass-substrate packaging while supporting the company's expansion into the semiconductor packaging supply chain.
In addition to advanced packaging, Intel and Lens Technology will explore cooperation in AI PC modules, high-reliability server components, cooling modules, embodied AI robots, industrial intelligent devices and edge computing hardware.
The collaboration reflects growing industry momentum behind glass substrate technologies as semiconductor manufacturers seek higher-performance packaging platforms to meet the increasing demands of AI and data centre applications.
