Thailand advances packaging plans
Thailand's new Siam Silica strategy aims to establish two advanced packaging facilities by 2030 as part of a broader effort to strengthen the country's semiconductor ecosystem.
Thailand has unveiled its Siam Silica semiconductor roadmap, placing advanced packaging at the centre of its strategy to become a leading semiconductor hub in Southeast Asia.
Announced by the Ministry of Higher Education, Science, Research and Innovation (MHESI), the initiative identifies advanced packaging as one of five strategic focus areas, alongside photonics fabrication, silicon design, quantum photonics and power devices.
The roadmap targets the establishment of two advanced semiconductor packaging facilities, one fabrication plant and eight integrated circuit design companies by 2030.
The strategy is designed to move Thailand beyond its traditional role in semiconductor assembly, packaging and testing by expanding into higher-value manufacturing and design activities.
The government is also launching workforce development programmes to build the engineering and technical skills needed to support the country's growing semiconductor sector.
Thailand is also seeking closer collaboration with ASEAN partners to strengthen regional semiconductor supply chains while attracting investment in advanced manufacturing capabilities.
Industry analysts have welcomed the roadmap but note that Thailand faces strong competition from established regional leaders such as Malaysia and Singapore.
They argue that sustained investment in technology, talent and manufacturing infrastructure will be essential if the country is to achieve its long-term ambitions.
By prioritising advanced packaging within its national semiconductor strategy, Thailand is aiming to strengthen its position in the global semiconductor value chain while supporting growing demand from AI, high-performance computing and next-generation electronic systems.
