ASMPT launches DALA system
New platform targets CMOS image sensor packaging and camera module assembly.
ASMPT has introduced DALA, a modular pick-and-place system designed to assemble camera module components for consumer electronics and automotive applications.
The fully automated system supports a range of processes, including die attach, lens holder bonding and glass attachment, with placement accuracy of ±7 µm.
It is designed to handle multiple bonding modes and material inputs, enabling flexibility across different package types and production requirements.
DALA integrates with ASMPT’s Smart COB inline platform for CMOS image sensor packaging, where it performs high-precision die attachment at the start of the process and lens holder bonding at later stages.
The system is designed to improve manufacturing efficiency and consistency in high-volume camera module production.
Target applications include smartphones, smart sensing devices and automotive systems such as advanced driver-assistance systems (ADAS).
