Advanced Packaging International 2026 agenda announced
The Advanced Packaging International 2026 agenda is now live, highlighting key innovations shaping next-generation semiconductor packaging.
The full agenda for Advanced Packaging International, taking place from 20 - 22 April 2026 at the Sheraton Airport Hotel in Brussels, Belgium, has now been finalised.
This marks the first Advanced Packaging International conference at AngelTech, joining CS International, PIC International, and Power Electronics International as part of the co-located event.
The event will feature around 40 presentations from industry and academia.
These fall within six key themes: heterogeneous integration; optimising incumbent solutions; thermal management; packaging architectures; manufacturing and pilot lines; and materials, design and reliability.
The programme will include speakers such as Peter O’Brien (Tyndall National Institute), Tyler J. Myers (Forge Nano), Bert Offrein (IBM), Eric Mounier (Yole Group), Zeina Abdallah (University of Bristol), and Jean-Charles Souriau (CEA-Leti), alongside other experts from across the semiconductor packaging ecosystem.
Delegates will gain insight into the materials, methods, and technologies driving the next era of semiconductor packaging while connecting with key players across the ecosystem.
Advanced Packaging International is part of AngelTech, bringing together more than 800 delegates, 80+ exhibitors and over 120 presentations.
