Lightmatter launches vClick optics for scalable CPO
Detachable fiber array units aim to accelerate high-volume optical interconnect production.
Lightmatter has unveiled vClick Optics, a detachable fiber array unit (FAU) technology designed to overcome scaling challenges in co-packaged optics (CPO).
Optimised for high-volume manufacturing, the solution enables low insertion loss (<1.5 dB), field serviceability, and high-bandwidth Dense Wavelength Division Multiplexing (DWDM) for next-generation optical interconnects.
The innovation integrates known-good optical engines with advanced packaging flows, allowing manufacturers to verify optical components before final assembly and reducing yield loss in complex AI chip packages.
vClick Optics supports mold-and-grind AP processes and enables automated assembly without active fiber alignment, making it compatible with large-scale 3D CPO production.
Lightmatter demonstrated the technology in collaboration with ASE and SENKO, highlighting its potential for hyperscale AI data centers and emerging XPU platforms.
Complementary to vClick, eClick Optics provides a high-performance edge-coupling solution for larger die complexes.
Lightmatter will showcase these technologies at the Optical Fiber Communication Conference (OFC 2026) in Los Angeles, March 15-19.
