IZMO targets defence with advanced packaging
The advanced packaging arm of IZMO Limited begins supplying high-reliability SiP and IC packaging solutions for India’s defence electronics sector.
Izmo Microsystems Pvt. Ltd., the advanced packaging subsidiary of IZMO Limited, has announced its entry into India’s defence electronics market.
The company will provide advanced semiconductor packaging solutions for mission-critical applications, including radar and sensing systems, high-frequency RF and microwave assemblies, airborne electronics for fighter aircraft and unmanned platforms, and precision guidance systems.
The move comes amid India’s increasing domestic procurement mandates and localisation initiatives, which reserve nearly 75% of capital defence acquisitions for domestic companies.
Izmo Microsystems’ capabilities include System-in-Package (SiP), IC packaging, silicon photonics, co-packaged optics, and high-reliability packaging, targeting the highest-complexity segments of the defence electronics supply chain.
This expansion underscores the growing role of advanced packaging in high-value, high-performance electronics for strategic applications.
