Hanic launches IC & packaging hub in Penang
Singapore-based Hanic establishes a new centre in Penang to accelerate IC design and advanced packaging for AI, automotive, and data centre applications.
Hanic has opened a new hub in Penang, Malaysia, focused on integrated circuit (IC) design and advanced 2.5D/3D packaging solutions.
The expansion aims to provide a seamless front-end and back-end design workflow, reducing time-to-market for high-performance chips in artificial intelligence, edge computing, automotive, and communications sectors.
Supported by InvestPenang, the hub is expected to create over 60 high-value engineering roles in system-on-chip (SoC) design, verification, physical design, design-for-test (DFT), and advanced packaging.
The move reinforces Penang’s growing reputation as a regional semiconductor and advanced packaging ecosystem, aligning with Malaysia’s National Semiconductor Strategy to strengthen design and packaging capabilities.
Hanic is also collaborating with partners to define a roadmap for advanced packaging innovation, positioning the company at the forefront of heterogeneous integration and next-generation computing solutions.
