Nanoverse unveils advanced packaging laser tools
Nanoverse Technologies has launched a new family of laser singulation and metrology systems, offering real-time process control, ultrafast wafer scribing, and high-precision die handling for advanced packaging and high-volume semiconductor manufacturing.
Nanoverse Technologies introduced its Advanced Packaging tool family, including the 5500, 6600, 7700, and 9900 platforms, designed to combine laser scribing, dicing, and integrated metrology in a single system.
The flagship NVT 7700 delivers industry-leading die break strength, processing up to 30 wafers per hour with less than 3 µm placement accuracy, while the NVT 5500 offers high-speed wafer inspection capable of 2D and 3D defect detection.
The tools support both prototyping and high-volume manufacturing, with features such as recipe-driven automation, SEMI compliance, and ultrafast laser adjustments.
The NVT 9900, set for release mid-2026, introduces a dual-laser configuration for flexible, high-speed singulation, representing a significant step forward for back-end processing in semiconductor packaging.
These systems aim to enhance yield, precision, and throughput for advanced packaging applications, making them relevant for chiplet, wafer-level, and heterogeneous integration processes.
