Malaysia advances IC design and packaging
Malaysia is stepping up its semiconductor strategy, focusing on IC design, advanced packaging, and high-value technologies. Initiatives by Mimos Bhd and MOSTI aim to develop talent, strengthen IP, and support commercialisation, shifting the country from assembly-focused manufacturing to technology ownership.
The Ministry of Science, Technology and Innovation (MOSTI), through Mimos Bhd, is accelerating efforts in integrated circuit (IC) design, advanced packaging, and other high-value semiconductor technologies.
The initiative is intended to help local companies transition into original design manufacturers (ODMs) and technology owners, reducing reliance on assembly-based operations.
Mimos has implemented strategies spanning R&D infrastructure, intellectual property development, technology transfer, and workforce training.
Programs through Mimos Academy include IC design, wafer fabrication, reliability engineering, and artificial intelligence, targeting the manpower needs of Malaysia’s growing technology sector.
Shared facilities at Mimos’ Semiconductor Technology Centre and Industry Technology Innovation Centre (ITIC) in Kulim provide wafer fabrication, IC testing, materials analysis, reliability testing, and co-design capabilities.
ITIC conducted 19 technical training sessions and seminars in 2025, engaging roughly 400 participants from 60 industry and academic institutions.
Proof-of-concept projects with local electronics companies provide access to shared equipment and technical expertise, strengthening the domestic value chain and accelerating commercialisation.
With over 1,400 patents filed, including 330 in semiconductors, Mimos supports technology transfer through licensing, co-development, and spin-offs.
Beyond semiconductors, MOSTI also backs startups via Cradle Fund Sdn Bhd, offering CIP Spark and CIP Sprint grants for prototype development and commercialisation.
Between 2020 and 2025, 101 products were commercialised under the Malaysian Research Accelerator for Technology and Innovation (MRANTI).
These efforts collectively aim to position Malaysia as a hub for advanced packaging, IC design, and semiconductor innovation, creating a robust ecosystem for technology-driven growth.
