ASMPT unveils advanced packaging systems at SEMICON Korea
ASMPT showcased high-precision solutions for AI, smart mobility, and hyperconnectivity at SEMICON Korea 2026, including multi-chip bonding, laser dicing, and camera module assembly platforms designed to boost productivity and reliability in advanced packaging.
ASMPT exhibited its latest advanced packaging and semiconductor assembly solutions at SEMICON Korea 2026, highlighting technologies designed to support AI, smart mobility, and hyperconnectivity.
At Booth D722 in the COEX Convention & Exhibition Centre, ASMPT presented key systems for high-precision assembly and packaging.
Highlights included DALA, a universal camera module assembly platform; MEGA, a multi-chip bonding solution; and ALSI LASER 1206, a fully automatic laser dicing and grooving system.
In addition, ASMPT showcased SIPLACE TX micron and SIPLACE CA2, placement platforms that integrated advanced packaging capabilities directly into SMT production lines.
These solutions addressed the growing demand for miniaturisation, high-density integration, and multi-die packaging.
With features such as ±7 µm bonding accuracy, multi-beam UV laser processing, and high-throughput die and component placement, ASMPT systems were positioned to enhance productivity, precision, and cost-efficiency in semiconductor manufacturing.
SEMICON Korea 2026 provided an opportunity for semiconductor manufacturers, chip designers, and packaging professionals to explore ASMPT’s portfolio and witness demonstrations of the latest assembly and packaging technologies.
