Lam Research unveils TEOS 3D for advanced packaging
Lam Research launches its VECTOR® TEOS 3D deposition tool, engineered for 3D chiplet integration. The system delivers void-free inter-die gapfill, improving yield, throughput, and process precision for AI and HPC applications.
Lam Research has introduced the VECTOR® TEOS 3D, a breakthrough deposition platform designed specifically for advanced packaging of next-generation AI and high-performance computing chips.
TEOS 3D tackles key challenges in 3D stacking and heterogeneous integration, providing uniform, ultra-thick inter-die gapfill films that support structural, thermal, and mechanical stability.
Using a proprietary bowed wafer handling approach and Lam Equipment Intelligence® technology, TEOS 3D enables precise deposition on high-bow, stress-prone wafers.
The system can deposit dielectric films up to 60 microns thick, scalable beyond 100 microns, while preventing common packaging failures such as delamination and void formation.
Key innovations include a single-pass process for crack-free films, a quad station module (QSM) for parallel processing and improved throughput, and integrated energy-efficient RF generators.
Together, these features deliver up to 70% faster throughput and a 20% reduction in cost of ownership compared with previous generation solutions.
“With VECTOR TEOS 3D, we can meet the demanding requirements of advanced die stacking architectures while ensuring yield and scalability,” said Sesha Varadarajan, Senior VP of Lam Research. “This is a critical tool for chipmakers moving beyond Moore’s Law into the AI era.”
Installed at leading logic and memory fabs worldwide, TEOS 3D represents Lam’s continued investment in advanced packaging solutions, enabling manufacturers to optimize chiplet integration and accelerate deployment of high-performance AI and HPC systems.
