Nanoparticle films boost advanced packaging
Shimane University researchers showcase ZnO nanoparticle-coated films at SEMICON Japan 2025, offering a low-cost, scalable approach to improve interface performance in optoelectronic packages, sensors, and transparent conductive devices.
Researchers from Shimane University’s Fujita–Yoshida Laboratory are pioneering semiconductor nanoparticle-coated films with single-crystal internal structures, demonstrating a “mixing, coating, and baking in air” process that eliminates the need for expensive single-crystal substrates.
The ZnO films enhance conductivity, manage energy density, and show potential for high-performance transparent electrodes, RFID elements, and sensor integration.
The technology addresses one of the key challenges in advanced semiconductor packaging: interface performance. By dispersing and coating ZnO nanoparticles, the films reduce energy density and mitigate heat effects, which can be critical for devices that integrate multiple chips or optoelectronic elements.
Unlike conventional single-crystal approaches, the nanoparticle method avoids vacuum-based fabrication, significantly lowering production costs to roughly one ten-thousandth of conventional semiconductor processes.
At SEMICON Japan, Professor Yasuhisa Fujita highlighted the versatility of the films, noting that they can be applied to advanced optoelectronic chip packages, transparent antennas, and sensors. The process is simple yet precise, allowing scalable production without compromising performance.
The ZnO films have already been commercialised through a university spin-off, marketed as high-speed phosphors, and show promise for research-driven applications in next-generation semiconductor packaging.
This approach could pave the way for more accessible, cost-effective, and high-performance devices across AI, IoT, and advanced imaging technologies.
